CES Resource Library
Calibration
Calibration Equipment List (items CES can calibrate) >>
A2LA Accreditation Certificate >>
Failure Analysis
Dye and Pry of BGA Solder Joints >>
SEM / EDX / Optical Microscopy Applications >>
X-Ray and Electron Probing Applications >>
X-Ray Applications >>
Literature and Publications List >>
3D X-Ray: Lead Frame Delamination 
3D X-Ray: Transformer Conductor Wire Failure
3D X-Ray: BGA Virtual Cross Section
3D X-Ray: Cell Phone Overview
3D X-Ray: BGA Solder Joint Fracture
Finite Element Analysis
PCB Modal Analysis Benefits
>>
A step by step approach highlighting the benefits of analyzing the modal response
of electronic structures.
PCBA Mechanical Shock Analysis
>>
A comprehensive frequency domain mechanical shock analysis example to virtually
quantify product shock durability.
A Random Vibration PSD Analysis of Electronic Boards
>>
A quick and effective example to virtually predict product reliability performance
under random vibration loads.
PCBA 3 Point Bend Fatigue Durability and Design Parametric Sensitivity Analysis>>
An example of systematic fatigue analysis to compare different PCBA thicknesses
for bending applications.
Viscoplastic Fatigue Life Analysis of Solder Joint Assemblies undergoing Temperature
Cycling
>>
A detailed stress and damage modeling example of solder joint fatigue under temperature
cycling loads highlighting the need for analysis to complement accelerated life
tests in predicting long term reliability.
Literature and Publications List >>
Lab Equipment
Download CES Lab Equipment Presentation >>
Physics of Failure
Literature and Publications List >>
Mechanics and Materials:
Estimating PCBA 3 Point Bend Durability >>
A Physics of Failure based approach is presented using mechanical bend test, Finite
element stress analysis and damage modeling tools, to estimate PCBA flexural durability.
Pb-free Connector Assembly Evaluation >>
A quick compression test and statistics based approach to compare solder paste candidates
for lead free connector assembly.
Comparison of elastomeric shock mounts for damping applications using DMA
>>
Damping performance of two shock mount material candidates is compared, using dynamic
material characterization tests.
Dynamic Material Characterization of Plastic Materials using DMA
>>
The long term effects of temperature and frequency on dynamic modulus of 2 plastic
materials are evaluated using material characterization test.
Network Interface PCBA Mechanical Shock User Enviroment Characterization using Test
and FEA >>
A mechanical shock test and finite element analysis based approach to quantify the
shock susceptibility of a Network Routers PCBA.
Literature and Publications List >>