Failure Analysis
Failure Analysis is a methodical engineering investigation of failures to determine the root cause, improve product reliability and reduce costs. A typical failure process flow proceeds from the most benign to a more destructive approach and can include:
- Visual inspection
- Optical imaging
- Electrical and Mechanical inspection
- Non-Destructive evaluation
- Destructive evaluation techniques
Failure analysis is performed at a component level (discrete devices, cable assembles), subassembly level (such as PCBAs), and fully integrated (complete) product level.
Benefits include:
- Product reliability insights
- Quality improvements
- Enhanced risk management and brand protection
- Minimizing potential product recall costs
- An understanding of product failure sites, modes and mechanisms
Personnel

CES Reliability Engineers are highly qualified in their respective
fields (MS, PhDs) and have many years of industry experience.
Our multi-disciplinary team working with our state-of-the-art lab equipment makes CES a unique resource to assist you with your Failure Analysis needs.
We can provide the right balance of smart investigation to solve your unique problem,
while taking into account prompt turn-around time and budget constraints.
As with all of our engineering services, we operate in an atmosphere of complete
confidentiality.
Equipment

The Failure Analysis lab houses the following equipment:
Non-Destructive Techniques:
Destructive Techniques:
Download the complete Failure
Analysis Equipment Presentation >>
Case Studies 
Dye and Pry of BGA Solder Joints
>>
SEM / EDX / Optical Microscopy Applications >>
X-Ray and Electron Probing Applications >>
X-Ray Applications >>
3D X-Ray: Lead Frame Delamination
3D X-Ray: Transformer Conductor Wire Failure
3D X-Ray: BGA Virtual Cross Section
3D X-Ray: Cell Phone Overview
3D X-Ray: BGA Solder Joint Fracture
These and more stored in the CES Resource
Library
Literature and Publications
H. Zhang, "Non-Destructive Failure Analysis Techniques for Product Reliability", SMTA Chapter Meeting, April 2010.
Antoinette M. Maniatty, G. Slade Cargill III, Youzhang
Ge, H. Zhang, and Laura Moyer, "Investigation of microstructural effects
on thermal and electromigration induced elastic strains", Session: 12-33-3, IMEC
2010.
H. Zhang, "Thermal and Electromigration Induced Strain and Microstructure
Evolution in Metal Conductor Lines" PhD Thesis, Lehigh University-Bethlehem, 2008
K. Upadhyayula, "Incremental Damage Superposition Approach for Surface Mount
Electronic Interconnect Durability under Combined Temperature and Vibration Environments",
PhD Thesis, University of Maryland, College Park, 1999.
H. Zhang, G. S. Cargill, "Electromigration induced strain relaxation in Cu
conductor lines", Journal of Materials Research, Vol. 26 (5) 2011.
H. Zhang, G. S. Cargill III, and A. M. Maniatty, "Thermal Strains in Passivated
Aluminum and Copper Conductor Lines", Journal of Materials Research, Vol. 26 (5)
2011.
H. Zhang, G. S. Cargill, "X-ray Microbeam Analysis of Electromigration in
Cu Interconnects" Chapter 7, Electromigration in Thin Films and Electronic Devices:
Materials and Reliability, Woodhead Publishing Limited 2010.
Antoinette M. Maniatty, Youzhang Ge, G. S. Cargill III, and H. Zhang, "Modeling,
Simulation, and X-ray Microbeam Studies", Chapter 4, Electromigration in Thin Films
and Electronic Devices: Materials and Reliability, Woodhead Publishing Limited 2010.
K. Upadhyayula, "Failure Analysis and Reliability Testing", MedTech, March
2009
K. Upadhyayula, "Why Test for Reliability", EMA/SMTA Chapter Meeting, May
2008
K. Upadhyayula, "Physics of Failure Approach to Product Reliability Workshop",
Jan 2008
H. Zhang, G. S Cargill III, Y. Ge, A. M. Maniatty, and W. Liu, "Strain Evolution
in Al Conductor Lines during Electromigration", Journal of Applied Physics, 104,
1063 2008.
Minhua Lu, Paul Lauro, Da-Yuan Shih, Robert Polastre, Charles Goldsmith, Donald
W. Henderson, H. Zhang, and Moon Gi Cho, "Comparison of Electromigration
Performance for Pb-free Solders and Surface Finishes with Ni UBM", ECTC, Session
8, 2008.
H. Zhang, G. Wang and G. S. Cargill III, "Local Melting During Electromigration
in Cu Conductor Lines," Journal of Electronic Materials, 36, 117 2007.
H. Zhang, G. S Cargill III, Y. Ge, A. M. Maniatty and W. Liu, "Grain-Scale
Strain and Orientation Measurements during Electromigration in Al Conductor Lines
by Synchrotron X-Ray Microbeam Diffraction", MRS Symp. D, Boston, MA 2007.
H. Zhang, G. S Cargill III, Y. Ge, A. M. Maniatty and W. Liu, "Strain Evolution
during Electromigration in Polycrystalline Conductor Lines: An X-Ray Microdiffraction
and Finite Element Modeling Study", Advanced Metallization Conference, Albany, NY
2007.
H. Zhang, G. Wang, and G. S. Cargill III, "Electrical Resistance Anomalies
During Electromigration Testing of Cu Conductor Lines: Examples of Local Melting?"
MRS Symp. Proc. 914, 0914-F06-08 2006.
G. Wang, H. Zhang, G. S. Cargill III, C.-K. Hu, L. Ge, and A. Maniatty, "Thermal
and Electromigration-Induced Strains in Copper Conductor Lines: X-ray Microbeam
Measurements and Analysis," MRS Symp. Proc. 914, 0914-F06-06 2006.
G. S. Cargill III, L. E. Moyer, G. Wang, H. Zhang, C.-K. Hu, W. Yang, B.
C.Larson, and G. E. Ice, "Thermal and Electromigration-Induced Strains in Polycrystalline
Films and Conductor Lines: X-ray Microbeam Measurements and Analysis," AIP Conf.
Proc. 817, 303 2006.
A. Dasgupta, P. Sharma, K. Upadhyayula, "Micro-Mechanics of Fatigue Damage
in Pb-Sn Solder due to Vibration and Thermal Cycling ", International Journal of
Damage Mechanics 10, 101-132, 2001.
K. Upadhyayula and A. Dasgupta, "A Physics-of-Failure Example of Acceleration
Factor Assessment for Accelerated Qualification of Electronic Systems", Proceedings
of Accelerated Stress Testing Workshop, IEEE CPMT, Pasadena, California, 1998.
K. Upadhyayula and A. Dasgupta, "Physics-of-Failure Guidelines for Accelerated
Qualification of Electronic Systems", International Journal of Quality and Reliability
Engineering, November 1998.
P. Sharma, K. Upadhyayula, L. Lantz, and M. Pecht, "Impact of Preconditioning
Voltage Bias and Temperature on Reliability of Plastic Encapsulated Microcircuits",
International Journal of Microelectronics Reliability, Vol. 38, No. 4, pp. 581-584,
1998.
K. Upadhyayula and A. Dasgupta, "Application of an Incremental Damage Superposition
Approach for Accelerated Durability of Surface Mount Interconnects Under Combined
Stresses", 1998 Spring Conference and Exposition, Society of Experimental Mechanics,
Houston, Texas, June 1-3, 1998.
K. Upadhyayula and A. Dasgupta, "Guidelines for Physics-of-Failure Based
Accelerated Stress Testing", Proceedings of Annual Reliability and Maintainability
Symposium, Anaheim, California, January 19-22, 1998.
K. Upadhyayula and A. Dasgupta, "An Incremental Damage Superposition Approach
for Interconnect Reliability Under Combined Accelerated Stresses", ASME International
Mechanical Engineering Congress & Exposition, Dallas, November 16-21, 1997.
P. Dujari, K. Upadhyayula, A. Dasgupta, and B. Balachandran, "Applications
of Wavelets for Cost-Effective Vibration Response Analysis of Electronic Circuit
Card Assemblies", Experimental and Numerical Mechanics in Electronic Packaging Proceedings,
Society of Experimental Mechanics, Bellevue, Washington, pp. 67-74, June 2-4,1997.
K. Upadhyayula and A. Dasgupta, "Accelerated Stress Testing of Surface-Mount
Interconnects under Combined Temperature and Vibration Loading", chapter in Accelerated
Stress Testing Handbook for Quality Products in a Global Market, H. Anthony Chan
(Ed.), Addison Wesley Longman, MA, 1997
A. Dasgupta, K. Darbha, P. Dujari, P. Haswell, S. Ling, P. Sharma, C. S. Sealing,
K. Upadhyayula, "Miscellaneous Issues in Thermomechanical Stress Analysis
of Surface-Mount Interconnects", Interpack 1997, ASME International, Intersociety
Electronics and Photonics Packaging Conference, June 1997.
A. Dasgupta, K. Darbha, P. Haswell, P. Sharma, S. Sealing, K. Upadhyayula,
"Finite Element Modeling Issues in Thermomechanical Stress Analysis of Surface-Mount
Interconnects", Symposium on Applications of FEM and BEM to Electronic Packaging
at the 1997 ASME/ASCE/SES Joint Conference, July 1997.
K. Darbha, S. Ling, K. Upadhyayula, and A. Dasgupta, "Stress Analysis of
Surface-Mount Interconnects Under Vibrational Loading", ASME International Mechanical
Engineering Congress & Exposition, Atlanta, GA, November 1996.
Y. Joshi, A. Dasgupta, K. Darbha, A. Poddar, C. Ramaswamy, C. S. Sealing, L. Tang,
K. Upadhyayula, "An Integrated Surface Mount Virtual Factory Based on Mechanistic
Process Simulations Part I - Overall Approach", ASME Winter Annual Meeting Conference,
Nov. 17-22, 1996, Atlanta, Georgia.
Y. Joshi, A. Dasgupta, K. Darbha, A. Poddar, C. Ramaswamy, C. S. Sealing, L. Tang,
K. Upadhyayula, "An Integrated Surface Mount Virtual Factory Based on Mechanistic
Process Simulations Part II - Examples of Virtual Factory Models for Surface Mount
Manufacturing", ASME Winter Annual Meeting Conference, Nov. 17-22, 1996, Atlanta,
Georgia.
K. Upadhyayula and A. Dasgupta, "Accelerated Testing of CCAs Under Combined
Temperature-Vibration Loading", Proceedings of Accelerated Stress Testing Workshop,
IEEE Components, Packaging, and Manufacturing Technology Society, Ottawa, Canada.
October 17-18, 1996.
K. Upadhyayula and A. Dasgupta, "Accelerated Life Test Development for Combined
Stresses", VIII International Congress on Experimental and Numerical Mechanics in
Electronic Packaging, Society of Experimental Mechanics, Nashville, TN, June 10-13,1996,
pp. 35-36.
Download the Failure Analysis Publications List>>
or visit the CES Resources Library
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