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Mechanical & Material Characterization
We leverage our state-of-the-art Mechanical
and Materials Test Lab to test, analyze and quantify behavior of a wide
variety of materials and mechanical structures. We routinely deal with material
properties investigations on DUT complexities ranging from the individual component
level (discrete devices, cable assembles) to PCBAs, sub-assemblies and complete
(entire) products.
Benefits include:
- Product reliability insights
- Quality improvements
- Minimizing potential product recall costs
- An understanding of product failure sites, modes and mechanisms
- Quantify product performance under use-case environments
- Quantify the impact of material selection and geometry on product performance
- Perform Industry Standard Tests such as ASTM, JEDEC, IPC etc.
Personnel

CES Engineers are highly qualified in their respective fields (MS and PhDs)
and have many years of industry experience. Our multi-disciplinary team working
with our fully equipped laboratory, makes CES a unique resource to assist you with
your needs. We can provide the right balance of smart investigation to solve your
unique problem, while taking into account prompt turn-around time and budget constraints.
As with all of our engineering services, we operate in an atmosphere of complete
confidentiality.
Equipment

The Mechanical and Materials Test Lab houses the following equipment:
- Instron-Universal Mechanical Test Machine: 50kN Frame Capability with Chamber
- Dynamic Mechanical Analyzer

- Thermo Mechanical Analyzer

- Mechanical Shock Machine

- Vibration Test Systems - Repetitive Shock and Electrodynamic Shakers

- Data Acquisition Equipment - Strain gages, Accelerometers, Thermocouples

- Adhesive Peel and Pull

- Fatigue Life Testing

Download the Mechanical
& Materials Equipment Presentation >>
Case Studies
Estimating PCBA 3 Point Bend Durability >>
Pb-free Connector Assembly Evaluation >>
Comparison of elastomeric shock mounts for damping applications using DMA
>>
Dynamic Material Characterization of Plastic Materials using DMA
>>
Network Interface PCBA Mechanical Shock User Enviroment Characterization using Test
and FEA >>
These and more stored in the CES Resource
Library
Literature and Publications
Antoinette M. Maniatty, G. Slade Cargill III, Youzhang Ge, H. Zhang, and
Laura Moyer, "Investigation of microstructural effects on thermal and electromigration
induced elastic strains", Session: 12-33-3, IMEC 2010.
K. Upadhyayula, "Practical Application of Physics of Failure Concepts-Case
Studies", Cascade Engineering Services, Redmond Oct 2010
Z. Tang , "Interfacial Reliability of Pb-free flip-chip BGA Package", Ph.D.
Thesis, Binghamton University, 2008
K. Upadhyayula, "Incremental Damage Superposition Approach for Surface Mount
Electronic Interconnect Durability under Combined Temperature and Vibration Environments",
PhD Thesis, University of Maryland, College Park, 1999.
H. Zhang, G. S. Cargill, "Electromigration induced strain relaxation in Cu
conductor lines", submitted to Applied Physics Letters 2010.
K. Upadhyayula, "Failure Analysis and Reliability Testing", MedTech, March
2009
K. Upadhyayula, "Why Test for Reliability", EMA/SMTA Chapter Meeting, May
2008
K. Upadhyayula, "Physics of Failure Approach to Product Reliability Workshop",
Cascade Engineering Services, Redmond Jan 2008
H. Zhang, G. S Cargill III, Y. Ge, A. M. Maniatty, and W. Liu, "Strain Evolution
in Al Conductor Lines during Electromigration", Journal of Applied Physics, 104,
1063 2008.
Minhua Lu, Paul Lauro, Da-Yuan Shih, Robert Polastre, Charles Goldsmith, Donald
W. Henderson, H. Zhang, and Moon Gi Cho, "Comparison of Electromigration
Performance for Pb-free Solders and Surface Finishes with Ni UBM", ECTC, Session
8, 2008.
H. Zhang, G. Wang and G. S. Cargill III, "Local Melting During Electromigration
in Cu Conductor Lines," Journal of Electronic Materials, 36, 117 2007.
SB Park, Z. Tang , and S. Chung "Temperature Effect of Interfacial Fracture
Toughness on Underfill for Pb-free Flip Chip Packages" 57th ECTC,2007
Z. Tang , SB Park, J. Lee and S. Chung "Effect of Board-Level Reflow on Adhesion
Between Lead-Free Solder and Underfill in Flip-Chip Packages" IMECE, 2007
H. Zhang, G. S Cargill III, Y. Ge, A. M. Maniatty and W. Liu, "Strain Evolution
during Electromigration in Polycrystalline Conductor Lines: An X-Ray Microdiffraction
and Finite Element Modeling Study", Advanced Metallization Conference, Albany, NY
2007.
H. Zhang, G. Wang, and G. S. Cargill III, "Electrical Resistance Anomalies
During Electromigration Testing of Cu Conductor Lines: Examples of Local Melting?"
MRS Symp. Proc. 914, 0914-F06-08 2006.
G. Wang, H. Zhang, G. S. Cargill III, C.-K. Hu, L. Ge, and A. Maniatty, "Thermal
and Electromigration-Induced Strains in Copper Conductor Lines: X-ray Microbeam
Measurements and Analysis," MRS Symp. Proc. 914, 0914-F06-06 2006.
S. Chung, Z. Tang , and SB Park "Delamination of Pb-free Flip Chip Underfill
during 2nd Level Interconnect Reflow" ECF 16,2006
G. S. Cargill III, L. E. Moyer, G. Wang, H. Zhang, C.-K. Hu, W. Yang, B.
C.Larson, and G. E. Ice, "Thermal and Electromigration-Induced Strains in Polycrystalline
Films and Conductor Lines: X-ray Microbeam Measurements and Analysis," AIP Conf.
Proc. 817, 303 2006.
S. Chung, Z. Tang , and SB Park, "Investigation of Phase Change of Flip Chip
Solders during the Second Level Interconnect Reflow" 55th ECTC,2005
S. Chung, Z. Tang , and SB Park, "Effects of Phase Change of Pb-free Flip-Chip
Solders during Board-Level Interconnect Reflow" 55th IEEE Transactions on Advanced
Packaging, PP38-43, 2005
A. Dasgupta, P. Sharma, K. Upadhyayula, "Micro-Mechanics of Fatigue Damage
in Pb-Sn Solder due to Vibration and Thermal Cycling ", International Journal of
Damage Mechanics 10, 101-132, 2001
K. Upadhyayula and A. Dasgupta, "A Physics-of-Failure Example of Acceleration
Factor Assessment for Accelerated Qualification of Electronic Systems", Proceedings
of Accelerated Stress Testing Workshop, IEEE CPMT, Pasadena, California, 1998.
K. Upadhyayula and A. Dasgupta, "Physics-of-Failure Guidelines for Accelerated
Qualification of Electronic Systems", International Journal of Quality and Reliability
Engineering, November 1998.
P. Sharma, K. Upadhyayula, L. Lantz, and M. Pecht, "Impact of Preconditioning
Voltage Bias and Temperature on Reliability of Plastic Encapsulated Microcircuits",
International Journal of Microelectronics Reliability, Vol. 38, No. 4, pp. 581-584,
1998.
K. Upadhyayula and A. Dasgupta, "Application of an Incremental Damage Superposition
Approach for Accelerated Durability of Surface Mount Interconnects Under Combined
Stresses", 1998 Spring Conference and Exposition, Society of Experimental Mechanics,
Houston, Texas, June 1-3, 1998.
K. Upadhyayula and A. Dasgupta, "Guidelines for Physics-of-Failure Based
Accelerated Stress Testing", Proceedings of Annual Reliability and Maintainability
Symposium, Anaheim, California, January 19-22, 1998.
K. Upadhyayula and A. Dasgupta, "An Incremental Damage Superposition Approach
for Interconnect Reliability Under Combined Accelerated Stresses", ASME International
Mechanical Engineering Congress & Exposition, Dallas, November 16-21, 1997.
P. Dujari, K. Upadhyayula, A. Dasgupta, and B. Balachandran, "Applications
of Wavelets for Cost-Effective Vibration Response Analysis of Electronic Circuit
Card Assemblies", Experimental and Numerical Mechanics in Electronic Packaging Proceedings,
Society of Experimental Mechanics, Bellevue, Washington, pp. 67-74, June 2-4,1997.
K. Upadhyayula and A. Dasgupta, "Accelerated Stress Testing of Surface-Mount
Interconnects under Combined Temperature and Vibration Loading", chapter in Accelerated
Stress Testing Handbook for Quality Products in a Global Market, H. Anthony Chan
(Ed.), Addison Wesley Longman, MA, 1997
A. Dasgupta, K. Darbha, P. Dujari, P. Haswell, S. Ling, P. Sharma, C. S. Sealing,
K. Upadhyayula, "Miscellaneous Issues in Thermomechanical Stress Analysis
of Surface-Mount Interconnects", Interpack 1997, ASME International, Intersociety
Electronics and Photonics Packaging Conference, June 1997.
A. Dasgupta, K. Darbha, P. Haswell, P. Sharma, S. Sealing, K. Upadhyayula,
"Finite Element Modeling Issues in Thermomechanical Stress Analysis of Surface-Mount
Interconnects", Symposium on Applications of FEM and BEM to Electronic Packaging
at the 1997 ASME/ASCE/SES Joint Conference, July 1997.
K. Darbha, S. Ling, K. Upadhyayula, and A. Dasgupta, "Stress Analysis of
Surface-Mount Interconnects Under Vibrational Loading", ASME International Mechanical
Engineering Congress & Exposition, Atlanta, GA, November 1996.
Y. Joshi, A. Dasgupta, K. Darbha, A. Poddar, C. Ramaswamy, C. S. Sealing, L. Tang,
K. Upadhyayula, "An Integrated Surface Mount Virtual Factory Based on Mechanistic
Process Simulations Part I - Overall Approach", ASME Winter Annual Meeting Conference,
Nov. 17-22, 1996, Atlanta, Georgia.
Y. Joshi, A. Dasgupta, K. Darbha, A. Poddar, C. Ramaswamy, C. S. Sealing, L. Tang,
K. Upadhyayula, "An Integrated Surface Mount Virtual Factory Based on Mechanistic
Process Simulations Part II - Examples of Virtual Factory Models for Surface Mount
Manufacturing", ASME Winter Annual Meeting Conference, Nov. 17-22, 1996, Atlanta,
Georgia.
K. Upadhyayula and A. Dasgupta, "Accelerated Testing of CCAs Under Combined
Temperature-Vibration Loading", Proceedings of Accelerated Stress Testing Workshop,
IEEE Components, Packaging, and Manufacturing Technology Society, Ottawa, Canada.
October 17-18, 1996.
K. Upadhyayula and A. Dasgupta, "Accelerated Life Test Development for Combined
Stresses", VIII International Congress on Experimental and Numerical Mechanics in
Electronic Packaging, Society of Experimental Mechanics, Nashville, TN, June 10-13,1996,
pp. 35-36.
Download the Mechanical
& Materials Publications List >>
or visit the CES Resources Library
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