Standards Based Reliability Overview
CES offers reliability testing to a large number of national and
international industry standards. These are detailed below,
together with a partial list of our equipment. If you have a need for testing and
do not see either the test or equipment here, contact us; we add to our capabilities
regularly. All CES equipment is continuously maintained and kept within calibration
limits.
Industry test standards we test to include:
- RTCA/DO-160
- IEC
- JDQ 53.3
- MIL-STD 810, MIL-STD 202
- ASTM
- Drop testing standards: ISO 2248, ASTM D-5276, ISTA (1A, 1B, 2A, 2B), TAPPI 802
- Telcordia testing standard GR-63-CORE
- European standard: ETSI EN 300 019-2-1
In accordance with the above industry test standards, we support the following markets:
- Aerospace
- Consumer and Industrial Electronics
- Telecommunication
- Medical
- Transportation
Our testing and associated equipment includes:
Environmental exposure
- Temperature (Soak & Cycle)
- Temperature and Humidity
- Thermal Shock

- Altitude (Vacuum) and Rapid Decompression
- Over-Pressure
- Salt Fog (Corrosion)
- Rain and Spray

- Freezing Rain (Icing)

- Settling Dust

- Drop

- Tumble

Vibration, Shock and Acceleration
- Vibration

- Shock - Time Domain

- Shock Response Spectra (SRS)

- Mechanical High G Shock

- Centrifuge (Constant Acceleration)
HALT and HASS

- Vibration, Temperature and load (mechanical or electrical)

Accelerated life

- Vibration and Shock

- Temperature and Humidity Cycling

- Vibration, Temperature and load (mechanical or electrical)

Package Testing
- Drop Testing

- Environmental Exposure (see above section: Environmental Exposure)
- Vibration Transportation (Random or Sinusoidal)

Data Acquisition System

- Test Data Measurements

Failure Analysis: Non-Destructive
- 3D X-Ray with CT Capability

- Elemental Dispersive X-Ray (EDX) for elemental analysis

- Scanning Electron Microscopy (SEM) - Low Vacuum

- Optical Microscopy

- Scanning Acoustic Microscopy
Failure Analysis: Destructive
- Metallographic Cross-section

- Scanning Electron Microscopy (SEM) - High and Low Vacuum

- Dye and Pry

- Optical Microscopy

- 3D X-Ray with CT Capability

- Elemental Dispersive X-Ray (EDX) for elemental analysis

- Scanning Acoustic Microscopy
Materials / Mechanical Testing
- Adhesive Pull & Peel

- Dynamic and Thermal Mechanical Analyzers
- Fatigue Life Testing

- Tension, Compression, 3&4 point Bend and Variable Angle Peel Testing
Download the complete CES Lab Equipment Presentation >>